Process and Test Equipment Engineer

  • Category
    Engineering - Electronic
  • Location
    Ipswich, Suffolk
  • External Reference
    2404
  • OrganizationType
    Engineering


My client is looking for an experienced manufacturing and process engineer to help support processes and
equipment that result in high-quality photonics products. As a part of the back end engineering team you'll
have a high level of technical expertise to further develop and plan continuous improvements of both
processes and test equipment. The ideal candidate will be a professional manufacturing engineer with
experience within the semiconductor or electronics industry. The position presents the chance to work within
a bright and highly-motivated multi-disciplinary team within a business that is expected to experience strong
growth for many years to come.
Main Responsibilities
 Support and develop production processes and equipment, working closely with operations teams to
effectively restore equipment or process breakdowns
 Utilise LEAN, Six Sigma, other best practice tools and principles for day-to-day problem solving and
for continuous improvements
 Implement and maintain effective process controls (SPC) to ensure quality controls against Quality
Control Plan and Out of Control Action Plan (QCP/OCAP)
 Create and maintain process flows, SOP's and PFMEA's
 Maintain and develop equipment preventative maintenance plans
 Work with R&D engineering team to qualify new processes or equipment
 Use experience and knowledge to continuously improve processes towards lean manufacturing
whilst maintaining quality
 Compile standard operating procedures (SOP's) and provide training to other personnel
 Any additional responsibility deemed necessary to ensure functional efficiency and development
Skills/Qualifications
Essential
 Minimum of HND or equivalent in an engineering discipline
 Minimum of 3 years related experience in manufacturing or assembly processes
 Proven track record of manufacturing process & equipment support ownership in electronics or
semiconductor manufacturing environment
 Proficient with electro-mechanical equipment with fundamental knowledge of electronics
September 2017
 Knowledge of SPC Lean manufacturing techniques, in particular first response to out of control/spec
events during production runs
 Possess excellent leadership & teamwork abilities, and organizational skills
 Ability to prioritize and multi-task in a fast paced environment
 Candidate must possess good verbal and written communication skills
Desirable
 Experience in Wire Bonding and/or surface mount PCB assembly
 SMT, Pick & Place, flying probe or AOI machine experience
 CAD experience (SolidWorks, AutoCAD, etc)
 Software skill such as LabVEW, C++, C Sharp, .NET, etc
 Post-graduate qualification in a relevant technology area
Personal Attributes
 Proven ability to work under own initiative with attention to detail
 Able to work calmly under pressure and to tight deadlines
 Proactive and innovative team player who is also capable of working independently
 Experience working in fast pace, dynamic environment, with limited supervision: self-starter.
 A level-headed, proactive team player and good communicator
 Good communication and interpersonal skills
 Ability to ensure prioritisation of workloads to meet business requirement
Additional Information:
Candidates must be eligible to, and hold all relevant finalised paperwork, to live and work in the UK. Copies
of Passports and Visas will be requested Spring Engineering Solutions (a trading name of Roevin Management Services Limited) acts as an employment agency for permanent recruitment and an employment business for the supply of temporary workers. Spring Engineering Solutions is an Equal Opportunities Employer.

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To speak to a recruitment expert please contact Claire Scott